Invention Grant
- Patent Title: Device and a method for reducing and homogenizing residual stress of a workpiece generated during machining
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Application No.: US16878892Application Date: 2020-05-20
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Publication No.: US11542570B2Publication Date: 2023-01-03
- Inventor: Chunguang Xu , Dezhi Li , Yuren Lu , Ruili Jia , Peng Yin
- Applicant: BEIJING INSTITUTE OF TECHNOLOGY
- Applicant Address: CN Beijing
- Assignee: BEIJING INSTITUTE OF TECHNOLOGY
- Current Assignee: BEIJING INSTITUTE OF TECHNOLOGY
- Current Assignee Address: CN Beijing
- Agency: Shumaker, Loop & Kendrick, LLP
- Agent John A. Miller
- Priority: CN201910431201.X 20190522
- Main IPC: B06B1/06
- IPC: B06B1/06 ; B06B3/00 ; C21D10/00

Abstract:
The present disclosure provides a device and a method for reducing and homogenizing residual stress during machining in which a workpiece is fixed, such as milling, boring, drilling and planning, with which high-energy acoustic waves are emitted to the workpiece via a tight contact between a plurality of high-energy wave exciters on a bench and a workpiece coated with a coupling medium, and residual stress inside the machined workpiece is reduced and homogenized through elastic wave energy generated in the workpiece by the high-energy acoustic waves. In this way, the purpose of reducing and homogenizing the residual stress while machining is achieved, realizing a stress-free machining, and the deformation of the workpiece during and after machining is minimized.
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