Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
-
Application No.: US16938468Application Date: 2020-07-24
-
Publication No.: US11542602B2Publication Date: 2023-01-03
- Inventor: Yoshitaka Miura
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2019-138211 20190726
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/56 ; C23C16/44 ; H01J23/10 ; H01L21/67 ; B24B57/02

Abstract:
A substrate processing apparatus includes: a processing container; an injector provided inside the processing container and having a shape extending in a longitudinal direction along which a processing gas is supplied; a holder fixed to the injector; a first magnet fixed to the holder and disposed inside the processing container; a second magnet separated from the first magnet by a partition plate and disposed outside the processing container; and a driving part configured to rotate the second magnet, wherein the first magnet and the second magnet are magnetically coupled to each other, and wherein by rotating the second magnet by the driving part, the first magnet magnetically coupled to the second magnet is rotated, and the injector rotates about the longitudinal direction as an axis.
Public/Granted literature
- US20210023677A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2021-01-28
Information query
IPC分类: