Invention Grant
- Patent Title: Sound reduction assembly, a ring configured to attenuate sound and a method
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Application No.: US17141594Application Date: 2021-01-05
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Publication No.: US11543017B2Publication Date: 2023-01-03
- Inventor: Sen J. Zhou , John Miller , Martin G. Foulkes , Jeffrey D. Curtis , Jack M. Gayney
- Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Applicant Address: US MI Detroit
- Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Current Assignee Address: US MI Detroit
- Agency: Quinn IP Law
- Main IPC: F16H57/028
- IPC: F16H57/028 ; F16H57/021

Abstract:
A sound reduction assembly includes a housing and a component supported via the housing. The component is movable relative to the housing. The sound reduction assembly includes a ring coupled to the component and the housing. The ring is configured to attenuate sound inducing vibrations in response to operation of the component. The ring includes a flange fixed relative to the housing to maintain a position of the ring relative to the component which maximizes attenuation of the sound in response to operation of the component. A method of utilizing a ring to attenuate sound inducing vibrations in response to operation of a component inside of a housing. A torque is selected to be applied to the ring. A stiffness of the ring is determined based on a stiffness-torque curve utilizing the selected torque to maximize attenuation of the sound. The ring is manufactured to meet the determined stiffness.
Public/Granted literature
- US20220213955A1 SOUND REDUCTION ASSEMBLY, A RING CONFIGURED TO ATTENUATE SOUND AND A METHOD Public/Granted day:2022-07-07
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