Sound reduction assembly, a ring configured to attenuate sound and a method
Abstract:
A sound reduction assembly includes a housing and a component supported via the housing. The component is movable relative to the housing. The sound reduction assembly includes a ring coupled to the component and the housing. The ring is configured to attenuate sound inducing vibrations in response to operation of the component. The ring includes a flange fixed relative to the housing to maintain a position of the ring relative to the component which maximizes attenuation of the sound in response to operation of the component. A method of utilizing a ring to attenuate sound inducing vibrations in response to operation of a component inside of a housing. A torque is selected to be applied to the ring. A stiffness of the ring is determined based on a stiffness-torque curve utilizing the selected torque to maximize attenuation of the sound. The ring is manufactured to meet the determined stiffness.
Information query
Patent Agency Ranking
0/0