Invention Grant
- Patent Title: Metal clip with solder volume balancing reservoir
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Application No.: US17155241Application Date: 2021-01-22
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Publication No.: US11545459B2Publication Date: 2023-01-03
- Inventor: Thomas Stoek , Michael Stadler , Mohd Hasrul Zulkifli
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/495
Abstract:
A semiconductor device includes a semiconductor die attached to a substrate and a metal clip attached to a side of the semiconductor die facing away from the substrate by a soldered joint. The metal clip has a plurality of slots dimensioned so as to take up at least 10% of a solder paste reflowed to form the soldered joint. Corresponding methods of production are also described.
Public/Granted literature
- US20220238475A1 METAL CLIP WITH SOLDER VOLUME BALANCING RESERVOIR Public/Granted day:2022-07-28
Information query
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