- 专利标题: Resonant process monitor
-
申请号: US15925739申请日: 2018-03-19
-
公开(公告)号: US11551905B2公开(公告)日: 2023-01-10
- 发明人: Yaoling Pan , Vijaykumar Krithivasan , Shimin Mao , Kelvin Chan , Michael D. Willwerth , Anantha Subramani , Ashish Goel , Chih-shun Lu , Philip Allan Kraus , Patrick John Tae , Leonard Tedeschi
- 申请人: APPLIED MATERIALS, INC.
- 申请人地址: US CA Santa Clara
- 专利权人: APPLIED MATERIALS, INC.
- 当前专利权人: APPLIED MATERIALS, INC.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01J37/244
- IPC分类号: H01J37/244 ; H01L21/67 ; H01L41/047 ; H01L41/053 ; H01L41/29 ; H01L41/04 ; H01J37/32 ; H01L41/31
摘要:
Embodiments described herein include a resonant process monitor and methods of forming such a resonant process monitor. In an embodiment, the resonant process monitor includes a frame that has a first opening and a second opening. In an embodiment, a resonant body seals the first opening of the frame. In an embodiment, a first electrode on a first surface of the resonant body contacts the frame and a second electrode is on a second surface of the resonant body. Embodiments also include a back plate that seals the second opening of the frame. In an embodiment the back plate is mechanically coupled to the frame, and the resonant body, the back plate, and interior surfaces of the frame define a cavity.
公开/授权文献
- US20190287758A1 RESONANT PROCESS MONITOR 公开/授权日:2019-09-19
信息查询