- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US16791938Application Date: 2020-02-14
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Publication No.: US11551963B2Publication Date: 2023-01-10
- Inventor: Wei Ling Ma , Ying-Chung Chen , Hsin-Ying Ho , Cheng-Ling Huang , Chang Chin Tsai
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/18 ; H01L21/82 ; H01L21/683 ; H01L31/18
Abstract:
A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.
Public/Granted literature
- US20210257246A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-08-19
Information query
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