Invention Grant
- Patent Title: Thermal management solutions using self-healing polymeric thermal interface materials
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Application No.: US16355468Application Date: 2019-03-15
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Publication No.: US11551997B2Publication Date: 2023-01-10
- Inventor: Amitesh Saha , Shushan Gong , Shrenik Kothari
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: H01L23/42
- IPC: H01L23/42 ; H01L21/48 ; H01L23/00
Abstract:
A thermal interface material may be formed comprising a polymer material and a self-healing constituent. The thermal interface material may be used in an integrated circuit assembly between at least one integrated and a heat dissipation device, wherein the self-healing constituent changes the physical properties of the thermal interface material in response to thermo-mechanical stresses to prevent failure modes from occurring during the operation of the integrated circuit assembly.
Public/Granted literature
- US20200294886A1 THERMAL MANAGEMENT SOLUTIONS USING SELF-HEALING POLYMERIC THERMAL INTERFACE MATERIALS Public/Granted day:2020-09-17
Information query
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