Invention Grant
- Patent Title: Micro device transfer head assembly
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Application No.: US16809386Application Date: 2020-03-04
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Publication No.: US11552046B2Publication Date: 2023-01-10
- Inventor: Andreas Bibi , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/67 ; B32B38/18 ; H01L33/62 ; H01L25/075 ; H01L29/167

Abstract:
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
Public/Granted literature
- US20200219840A1 MICRO DEVICE TRANSFER HEAD ASSEMBLY Public/Granted day:2020-07-09
Information query
IPC分类: