公开(公告)号：US11476239B2

公开(公告)日：2022-10-18

申请号：US17072240

申请日：2020-10-16

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibi ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/44 ,  H01L23/31 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US11380862B2

公开(公告)日：2022-07-05

申请号：US17186362

申请日：2021-02-26

Applicant: Apple Inc.

Inventor： Andreas Bibi ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L51/50 ,  H01L27/15 ,  G09G3/00 ,  H01L23/00 ,  H01L21/683 ,  H01L27/32 ,  H01L27/12 ,  G09G3/3208

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：US11676953B2

公开(公告)日：2023-06-13

申请号：US17663777

申请日：2022-05-17

Applicant: Apple Inc.

Inventor： Andreas Bibi ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F3/042 ,  G06F3/041 ,  H01L25/16 ,  G06F1/16 ,  G09G3/32 ,  H01L25/075 ,  G04G9/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  G06F3/14

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/042 ,  G06F3/0412 ,  G09G3/32 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  G06F3/14 ,  G09G2380/02 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

公开(公告)号：US11552046B2

公开(公告)日：2023-01-10

申请号：US16809386

申请日：2020-03-04

Applicant: Apple Inc.

Inventor： Andreas Bibi ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L23/00 ,  H01L21/67 ,  B32B38/18 ,  H01L33/62 ,  H01L25/075 ,  H01L29/167

Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.