Invention Grant
- Patent Title: Embedded component package structure and manufacturing method thereof
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Application No.: US17342363Application Date: 2021-06-08
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Publication No.: US11553596B2Publication Date: 2023-01-10
- Inventor: Chien-Fan Chen , Chien-Hao Wang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/18 ; H01L21/48 ; H01L23/538 ; H01L21/56

Abstract:
A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.
Public/Granted literature
- US20210298176A1 EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2021-09-23
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