Invention Grant
- Patent Title: Foldable hinge for electronic devices
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Application No.: US16075755Application Date: 2017-04-20
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Publication No.: US11553612B2Publication Date: 2023-01-10
- Inventor: Wei-Chung Chen , Kuan-Ting Wu , Chi-Hao Chang
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Houston
- Agency: HPI Patent Department
- International Application: PCT/US2017/028512 WO 20170420
- International Announcement: WO2018/194605 WO 20181025
- Main IPC: H05K5/02
- IPC: H05K5/02 ; G06F1/16 ; E05D3/18 ; E05D1/04

Abstract:
A foldable hinge is described herein that includes a plurality of interconnected sliding links, wherein each of the interconnected sliding links comprise at least one curved extruding prong and at least one curved rail. The at least one curved rail of a first interconnected sliding link can be coupled to the at least one curved extruding prong of a second interconnected sliding link to form a torque engine. Additionally, the interconnected sliding links can be rotatable based on a pressure applied to the interconnected sliding links. The foldable hinge can also include a plurality of shafts coupled to the plurality of interconnected sliding links, wherein each shaft is coupled to a separate interconnected sliding link.
Public/Granted literature
- US20210207648A1 FOLDABLE HINGE FOR ELECTRONIC DEVICES Public/Granted day:2021-07-08
Information query