Invention Grant
- Patent Title: Laser machine for cutting workpiece
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Application No.: US16820120Application Date: 2020-03-16
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Publication No.: US11554444B2Publication Date: 2023-01-17
- Inventor: Ryousuke Nakamura , Takashi Izumi
- Applicant: Fanuc Corporation
- Applicant Address: JP Yamanashi
- Assignee: Fanuc Corporation
- Current Assignee: Fanuc Corporation
- Current Assignee Address: JP Yamanashi
- Agency: RatnerPrestia
- Priority: JPJP2019-050111 20190318
- Main IPC: B23K26/14
- IPC: B23K26/14 ; B23K26/064 ; B23K26/03 ; B23K26/04 ; B23K26/06

Abstract:
A laser machine able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. The laser machine comprising a machining head configured to emit a laser beam and an assist gas coaxially and non-coaxially; and a data table in which data of a machining condition for cutting a workpiece using the machining head, and a shift amount, by which a center axis of the assist gas is to be shifted from an optical axis of the laser beam in order to make cutting quality on both sides of a cutting line to be different during cutting the workpiece, are stored in associated with each other.
Public/Granted literature
- US20200298337A1 LASER MACHINE FOR CUTTING WORKPIECE Public/Granted day:2020-09-24
Information query
IPC分类: