Invention Grant
- Patent Title: ISA extension for high-bandwidth memory
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Application No.: US17121488Application Date: 2020-12-14
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Publication No.: US11556476B2Publication Date: 2023-01-17
- Inventor: Mu-Tien Chang , Krishna T. Malladi , Dimin Niu , Hongzhong Zheng
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Main IPC: G06F12/0875
- IPC: G06F12/0875 ; G06F13/16 ; G06F13/12 ; G06F9/30

Abstract:
A method of processing in-memory commands in a high-bandwidth memory (HBM) system includes sending a function-in-HBM instruction to the HBM by a HBM memory controller of a GPU. A logic component of the HBM receives the FIM instruction and coordinates the instructions execution using the controller, an ALU, and a SRAM located on the logic component.
Public/Granted literature
- US20210096999A1 ISA EXTENSION FOR HIGH-BANDWIDTH MEMORY Public/Granted day:2021-04-01
Information query
IPC分类: