-
公开(公告)号:US11940922B2
公开(公告)日:2024-03-26
申请号:US18081488
申请日:2022-12-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Mu-Tien Chang , Krishna T. Malladi , Dimin Niu , Hongzhong Zheng
IPC: G06F12/0875 , G06F13/12 , G06F13/16 , G06F9/30
CPC classification number: G06F12/0875 , G06F13/124 , G06F13/1636 , G06F13/1689 , G06F9/3001 , G06F9/30098 , G06F2212/452
Abstract: A method of processing in-memory commands in a high-bandwidth memory (HBM) system includes sending a function-in-HBM instruction to the HBM by a HBM memory controller of a GPU. A logic component of the HBM receives the FIM instruction and coordinates the instructions execution using the controller, an ALU, and a SRAM located on the logic component.
-
公开(公告)号:US11934669B2
公开(公告)日:2024-03-19
申请号:US16942641
申请日:2020-07-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Dimin Niu , Shuangchen Li , Bob Brennan , Krishna T. Malladi , Hongzhong Zheng
IPC: G06F3/06 , G06F15/78 , G11C11/4096
CPC classification number: G06F3/0631 , G06F3/0604 , G06F3/067 , G06F15/7821 , G11C11/4096
Abstract: A processor includes a plurality of memory units, each of the memory units including a plurality of memory cells, wherein each of the memory units is configurable to operate as memory, as a computation unit, or as a hybrid memory-computation unit.
-
公开(公告)号:US20230069786A1
公开(公告)日:2023-03-02
申请号:US18045332
申请日:2022-10-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Krishna T. Malladi , Andrew Chang
IPC: G06F9/30 , G06F9/38 , G06F12/0817 , G06F13/16 , G06F13/42
Abstract: A system for computing. In some embodiments, the system includes: a memory, the memory including one or more function-in-memory circuits; and a cache coherent protocol interface circuit having a first interface and a second interface. A function-in-memory circuit of the one or more function-in-memory circuits may be configured to perform an operation on operands including a first operand retrieved from the memory, to form a result. The first interface of the cache coherent protocol interface circuit may be connected to the memory, and the second interface of the cache coherent protocol interface circuit may be configured as a cache coherent protocol interface on a bus interface.
-
公开(公告)号:US20220206917A1
公开(公告)日:2022-06-30
申请号:US17699679
申请日:2022-03-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Krishna T. Malladi , Wenqin Huangfu
Abstract: A method for computing. In some embodiments, the method includes: calculating an advantage score of a first computing task, the advantage score being a measure of an extent to which a plurality of function in memory circuits is capable of executing the first computing task more efficiently by than one or more extra-memory processing circuits, the first computing task including instructions and data; in response to determining that the advantage score of the first computing task is less than a first threshold, executing the first computing task by the one or more extra-memory processing circuits; and in response to determining that the first computing task is at least equal to the first threshold: compiling the instructions for execution by the function in memory circuits; formatting the data for the function in memory circuits; and executing the first computing task, by the function in memory circuits.
-
公开(公告)号:US20210406202A1
公开(公告)日:2021-12-30
申请号:US17469769
申请日:2021-09-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Krishna T. Malladi , Hongzhong Zheng , Dimin Niu , Peng Gu
Abstract: A high bandwidth memory (HBM) system includes a first HBM+ card. The first HBM+ card includes a plurality of HBM+ cubes. Each HBM+ cube has a logic die and a memory die. The first HBM+ card also includes a HBM+ card controller coupled to each of the plurality of HBM+ cubes and configured to interface with a host, a pin connection configured to connect to the host, and a fabric connection configured to connect to at least one HBM+ card.
-
公开(公告)号:US20210311739A1
公开(公告)日:2021-10-07
申请号:US16914129
申请日:2020-06-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Krishna T. Malladi , Andrew Chang
IPC: G06F9/30 , G06F9/38 , G06F12/0817 , G06F13/16 , G06F13/42
Abstract: A system for computing. In some embodiments, the system includes: a memory, the memory including one or more function-in-memory circuits; and a cache coherent protocol interface circuit having a first interface and a second interface. A function-in-memory circuit of the one or more function-in-memory circuits may be configured to perform an operation on operands including a first operand retrieved from the memory, to form a result. The first interface of the cache coherent protocol interface circuit may be connected to the memory, and the second interface of the cache coherent protocol interface circuit may be configured as a cache coherent protocol interface on a bus interface.
-
公开(公告)号:US20210278992A1
公开(公告)日:2021-09-09
申请号:US16914151
申请日:2020-06-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Krishna T. Malladi
IPC: G06F3/06
Abstract: A method for in-memory computing. In some embodiments, the method includes: executing, by a first function-in-memory circuit, a first instruction, to produce, as a result, a first value, wherein a first computing task includes a second computing task and a third computing task, the second computing task including the first instruction; storing, by the first function-in-memory circuit, the first value in a first buffer; reading, by a second function-in- memory circuit, the first value from the first buffer; and executing, by a second function-in- memory circuit, a second instruction, the second instruction using the first value as an argument, the third computing task including the second instruction, wherein: the storing, by the first function-in-memory circuit, of the first value in the first buffer includes directly storing the first value in the first buffer.
-
公开(公告)号:US20210271594A1
公开(公告)日:2021-09-02
申请号:US17322805
申请日:2021-05-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Krishna T. Malladi , Jongmin Gim , Hongzhong Zheng
Abstract: A pseudo main memory system. The system includes a memory adapter circuit for performing memory augmentation using compression, deduplication, and/or error correction. The memory adapter circuit is connected to a memory, and employs the memory augmentation methods to increase the effective storage capacity of the memory. The memory adapter circuit is also connected to a memory bus and implements an NVDIMM-F or modified NVDIMM-F interface for connecting to the memory bus.
-
公开(公告)号:US20210096999A1
公开(公告)日:2021-04-01
申请号:US17121488
申请日:2020-12-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: Mu-Tien Chang , Krishna T. Malladi , Dimin Niu , Hongzhong Zheng
IPC: G06F12/0875 , G06F13/16 , G06F13/12
Abstract: A method of processing in-memory commands in a high-bandwidth memory (HBM) system includes sending a function-in-HBM instruction to the HBM by a HBM memory controller of a GPU. A logic component of the HBM receives the FIM instruction and coordinates the instructions execution using the controller, an ALU, and a SRAM located on the logic component.
-
公开(公告)号:US10915451B2
公开(公告)日:2021-02-09
申请号:US16439613
申请日:2019-06-12
Applicant: Samsung Electronics Co., Ltd.
Inventor: Krishna T. Malladi , Mu-Tien Chang , Dimin Niu , Hongzhong Zheng
IPC: G06F12/08 , G06F12/0879 , G11C11/417
Abstract: A high bandwidth memory system. In some embodiments, the system includes: a memory stack having a plurality of memory dies and eight 128-bit channels; and a logic die, the memory dies being stacked on, and connected to, the logic die; wherein the logic die may be configured to operate a first channel of the 128-bit channels in: a first mode, in which a first 64 bits operate in pseudo-channel mode, and a second 64 bits operate as two 32-bit fine-grain channels, or a second mode, in which the first 64 bits operate as two 32-bit fine-grain channels, and the second 64 bits operate as two 32-bit fine-grain channels.
-
-
-
-
-
-
-
-
-