Invention Grant
- Patent Title: Reduced pitch memory subsystem for memory device
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Application No.: US16986776Application Date: 2020-08-06
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Publication No.: US11557537B2Publication Date: 2023-01-17
- Inventor: Michael A. Smith , Haitao Liu , Vladimir Mikhalev
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/092 ; H01L21/8238 ; H01L23/528 ; H01L27/11 ; H01L29/66

Abstract:
A memory device includes an array of memory cells and a plurality of bit-lines with each bit-line connected to a respective set of memory cells of the array of memory cells. The memory device includes a memory subsystem having first and second memory circuits. Each first memory circuit can be disposed laterally adjacent to a second memory circuit. Each first memory circuit includes a first bit-line connection and each second memory circuit including a second bit-line connection, the first and second bit-line connections can connect to respective bit-lines. Each first bit-line connection is disposed on a first bit-line connection line of the memory subsystem and each second bit-line connection is disposed on a second bit-line connection line of the memory subsystem, and the second bit-line connection line can be offset from the first bit-line connection line by a predetermined distance that is greater than zero.
Information query
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