Invention Grant
- Patent Title: Nonvolatile memory device
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Application No.: US16911299Application Date: 2020-06-24
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Publication No.: US11557599B2Publication Date: 2023-01-17
- Inventor: Dongha Shin , Yohan Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2019-0160128 20191204
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11573 ; H01L27/11524 ; H01L27/11556 ; H01L27/11529 ; G11C16/08 ; H01L23/522 ; H01L23/528 ; G11C16/04 ; H01L27/1157

Abstract:
A nonvolatile memory device includes; a memory cell area including a cell structure and a common source plate. The memory cell area is mounted on a peripheral circuit area including a buried area covered by the memory cell area and an exposed area uncovered by the memory cell area. A first peripheral circuit (PC) via extending from the exposed area, and a common source (CS) via extending from the common source plate, wherein the first PC via and the CS via are connected by a CS wire disposed outside the cell structure and providing a bias voltage to the common source plate.
Public/Granted literature
- US20210175243A1 NONVOLATILE MEMORY DEVICEE Public/Granted day:2021-06-10
Information query
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