Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
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Application No.: US17025120Application Date: 2020-09-18
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Publication No.: US11557604B2Publication Date: 2023-01-17
- Inventor: Seongyeon Woo , Sangjun Hong , Jinsoo Lim , Jisung Cheon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2019-0168141 20191216
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11565 ; G11C8/14 ; H01L27/11556 ; H01L27/11519

Abstract:
A semiconductor device includes: a first gate stack including a plurality of first gate electrodes; a second gate stack arranged on the first gate stack and including a plurality of second gate electrodes; and a plurality of channel structures arranged in a plurality of channel holes penetrating the first gate stack and the second gate stack. Each of the channel holes includes a first channel hole portion penetrating the first gate stack and a second channel hole portion penetrating the second gate stack, and a ratio of a second width in the second direction to a first width in the first direction of an upper end of the first channel hole portion is less than a ratio of a fourth width in the second direction to a third width in the first direction of an upper end of the second channel hole portion.
Public/Granted literature
- US20210183885A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2021-06-17
Information query
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