发明授权
- 专利标题： Planarization apparatus, planarization process, and method of manufacturing an article
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申请号： US16779205申请日： 2020-01-31
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公开(公告)号： US11562924B2公开(公告)日： 2023-01-24
- 发明人: Seth J. Bamesberger , Ozkan Ozturk , Christopher Ellis Jones , Se-Hyuk Im
- 申请人： CANON KABUSHIKI KAISHA
- 申请人地址： JP Tokyo
- 专利权人： CANON KABUSHIKI KAISHA
- 当前专利权人： CANON KABUSHIKI KAISHA
- 当前专利权人地址： JP Tokyo
- 代理机构： Canon U.S.A., Inc., IP Division
- 主分类号： H01L21/76
- IPC分类号： H01L21/76 ; H01L21/768 ; H01L21/321 ; H01L21/67
摘要：
A superstrate for planarizing a substrate. The superstrate includes a body having a first side having a contact surface and a second side having a central portion and a peripheral portion surrounding the central portion. The peripheral portion includes a recessed region.
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