Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16375582Application Date: 2019-04-04
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Publication No.: US11565351B2Publication Date: 2023-01-31
- Inventor: Toshinaru Suzuki , Dokyun Kwon , Jaebum Pahk , Jinwon Baek , Jeongho Yi , Jinpyung Lee , Kyongho Hong
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2018-0041019 20180409
- Main IPC: B23K26/36
- IPC: B23K26/36 ; B23K26/38 ; H01L21/687 ; B23K26/70
Abstract:
A substrate processing apparatus includes the following: a support frame, first stage, a suction part, and a plurality of island-type second stages. The support frame is disposed on the first stage. The height of the support frame is lower than the height of the first stage. A plurality of island-type second stages are disposed on the support frame on the same plane as the first stage. The suction part is disposed on the support frame.
Public/Granted literature
- US20190308276A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2019-10-10
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