Invention Grant
- Patent Title: Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device
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Application No.: US16689389Application Date: 2019-11-20
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Publication No.: US11567405B2Publication Date: 2023-01-31
- Inventor: Takeshi Kawabata , Kenta Yoshida , Yu Iwai , Akinori Shibuya
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2017-108409 20170531
- Main IPC: G03F7/037
- IPC: G03F7/037 ; G03F7/004 ; C08G73/10 ; C08G73/22 ; H01L23/29 ; H01L21/56 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/38
Abstract:
A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.
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