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公开(公告)号：US11487202B2
公开(公告)日：2022-11-01
申请号：US16689389
申请日：2019-11-20
申请人： FUJIFILM Corporation
发明人： Takeshi Kawabata , Kenta Yoshida , Yu Iwai , Akinori Shibuya
IPC分类号： G03F7/037 , G03F7/004 , C08G73/10 , C08G73/22 , H01L23/29 , H01L21/56 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/38
摘要： A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.
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公开(公告)号：US11441053B2
公开(公告)日：2022-09-13
申请号：US16546996
申请日：2019-08-21
申请人： FUJIFILM Corporation
发明人： Naoya Shimoju , Akinori Shibuya , Yuichiro Goto
IPC分类号： C09J7/30 , C09J5/00 , C09J133/14 , C09J133/04 , C08L33/14 , C08L33/04 , B32B3/26 , B32B7/12 , B32B9/00 , B32B9/04 , B32B27/30 , B32B37/12 , B32B37/15 , B32B38/00 , H01L21/027 , B29C59/02 , B29K105/00 , G03F7/00
摘要： There are provided a composition for forming an adhesive film for imprinting having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting contains a resin having a polymerizable group; and a solvent, in which the resin has at least one kind of a repeating unit derived from a polymerizable compound having a C log P value less than or equal to 0, and solubility of the resin in water at 25° C. is greater than or equal to 1 mass %, provided that the C log P value is a coefficient showing affinity of an organic compound with respect to water and 1-octanol.
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公开(公告)号：US20200157267A1
公开(公告)日：2020-05-21
申请号：US16750585
申请日：2020-01-23
申请人： FUJIFILM Corporation
发明人： Naoya SHIMOJU , Akinori Shibuya , Yuichiro Goto
IPC分类号： C08F222/16 , G03F7/00 , H01L21/027
摘要： The curable composition for imprinting includes: a compound represented by the following Formula (1); a radically polymerizable compound other than the compound represented by Formula (1); and a photoradical polymerization initiator, in Formula (1), R1 and R2 each independently represent a hydrogen atom or an organic group having 1 to 8 carbon atoms and may be bonded to each other to form a ring, R3 represents a monovalent organic group, and R4 and R5 each independently represent a hydrogen atom or a monovalent organic group.
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公开(公告)号：US10501580B2
公开(公告)日：2019-12-10
申请号：US15824360
申请日：2017-11-28
申请人： FUJIFILM Corporation
发明人： Takeshi Kawabata , Takuma Amemiya , Hidekazu Oohashi , Yu Iwai , Akinori Shibuya
IPC分类号： C08G73/10 , G03F7/021 , G03F7/023 , G03F7/038 , H01L23/29 , H01L23/31 , H01L25/065 , H01L25/07 , H01L25/18 , C08F290/14 , G03F7/031 , G03F7/037 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , H01L23/00
摘要： A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.
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公开(公告)号：US09841679B2
公开(公告)日：2017-12-12
申请号：US15158848
申请日：2016-05-19
申请人： FUJIFILM Corporation
发明人： Masafumi Kojima , Akiyoshi Goto , Akinori Shibuya , Keita Kato , Kei Yamamoto
CPC分类号： G03F7/0397 , G03F7/0045 , G03F7/0046 , G03F7/038 , G03F7/11 , G03F7/20 , G03F7/2041 , G03F7/325
摘要： An actinic ray-sensitive or radiation-sensitive resin composition contains a resin (P) having a partial structure represented by General Formula (X), and a compound capable of generating an acid upon irradiation with actinic ray or radiation.
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公开(公告)号：US11899361B2
公开(公告)日：2024-02-13
申请号：US16988033
申请日：2020-08-07
申请人： FUJIFILM Corporation
IPC分类号： G03F7/00 , C08F220/28 , C08F220/30 , B29C59/02 , B29C59/16 , G03F7/11 , G03F7/16
CPC分类号： G03F7/0002 , B29C59/02 , B29C59/16 , C08F220/283 , C08F220/303 , G03F7/11 , G03F7/161
摘要： Provided is a kit including a curable composition for imprinting which contains a polymerizable compound having an aromatic ring and a composition for forming an underlayer film for imprinting which contains a polymer and a solvent, in which the polymer contains at least one kind of specific constitutional unit and has a polymerizable group, a film formed of the composition for forming an underlayer film for imprinting is a solid film at 23° C., and a portion that has a continuous partial structure containing an aromatic ring which is included in the polymerizable compound and accounts for 60% by mass or more of the polymerizable compound is common to a continuous partial structure containing an aromatic ring which is included in a substituent R in a side chain in the polymer. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting which is used in combination with a curable composition for imprinting; a laminate; a method for producing a laminate; a method for producing a cured product pattern; and a method for manufacturing a circuit board.
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公开(公告)号：US10780679B2
公开(公告)日：2020-09-22
申请号：US15940321
申请日：2018-03-29
申请人： FUJIFILM Corporation
发明人： Yu Iwai , Takeshi Kawabata , Akinori Shibuya
IPC分类号： B32B27/28 , H01L23/14 , G03F7/027 , G03F7/40 , B32B15/08 , B32B15/20 , B32B27/16 , H01L23/12 , B32B3/30 , G03F7/038 , G03F7/32 , H01L23/498 , H01L25/065 , H01L25/00
摘要： Provided is a laminate that excels in adhesion among a plurality of resin layers formed as insulating layers containing polyimide and so forth, a method for manufacturing the laminate, a semiconductor device, and, a method for manufacturing the semiconductor device. The laminate comprises a substrate, and at least two resin layers, each of the resin layers is independently brought into contact, in at least a part of the surface thereof, with other resin layer, and the layers independently has a Young's modulus exceeding 2.8 GPa and not exceeding 5.0 GPa, and, an elongation after fracture exceeding 50% and not exceeding 200%, and further has a three-dimensional radical crosslinked structure, and at least one of the resin layers contains at least either polyimide or polybenzoxazole.
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公开(公告)号：US10649329B2
公开(公告)日：2020-05-12
申请号：US15384521
申请日：2016-12-20
申请人： FUJIFILM Corporation
发明人： Shohei Kataoka , Akinori Shibuya , Keiyu Ou
IPC分类号： G03F7/004 , G03F7/38 , G03F7/40 , G03F7/038 , G03F7/039 , G03F7/09 , G03F7/16 , G03F7/20 , G03F7/32
摘要： An active-light-sensitive or radiation-sensitive resin composition includes a basic compound (A) corresponding to at least one of the following basic compound (A1) or (A2): (A1) a nonionic compound having an alicyclic structure (a1) and a basic site (b2) at a site different from the alicyclic structure within one molecule, or (A2) a nonionic compound having a heterocyclic structure (a2) having no basicity and a basic site (b2) at a site different from the heterocyclic structure within one molecule.
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9.发明授权公开(公告)号：US10450417B2
公开(公告)日：2019-10-22
申请号：US15938528
申请日：2018-03-28
申请人： FUJIFILM Corporation
发明人： Takeshi Kawabata , Yu Iwai , Akinori Shibuya
IPC分类号： C08G73/12 , C08F290/14 , C08F299/02 , C08G73/22 , G03F7/027 , G03F7/20 , G03F7/031 , G03F7/037 , G03F7/038 , G03F7/16 , G03F7/32 , H01L23/498 , C08G73/10 , C09D179/08 , C08G73/14 , G03F7/023 , G03F7/075 , H01L25/065
摘要： Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.
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10.发明授权Pattern forming method, method for manufacturing electronic device, and electronic device 有权图案形成方法，电子装置的制造方法以及电子装置公开(公告)号：US09405197B2
公开(公告)日：2016-08-02
申请号：US14625782
申请日：2015-02-19
申请人： FUJIFILM Corporation
IPC分类号： G03F7/004 , G03F7/30 , H01L21/027 , C07C381/12 , C08F220/18 , C08F220/26 , C08F220/24 , C08F220/38 , G03F7/039 , G03F7/11 , G03F7/20 , G03F7/32 , G03F7/038
CPC分类号： G03F7/30 , C07C381/12 , C08F220/18 , C08F220/24 , C08F220/26 , C08F220/38 , G03F7/0045 , G03F7/0046 , G03F7/038 , G03F7/0388 , G03F7/0397 , G03F7/11 , G03F7/2041 , G03F7/325 , H01L21/0274
摘要： There is provided a pattern forming method containing: forming a film by using a radiation-sensitive or actinic ray-sensitive resin composition containing: (A) a onium salt compound containing a nitrogen atom in a cationic moiety; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and (C) a resin capable of increasing the polarity by the action of an acid to decrease solubility in a developer containing an organic solvent, exposing the film; and developing the exposed film by using a developer containing an organic solvent to form a negative pattern.
摘要翻译： 提供了一种图案形成方法，其包括：通过使用辐射敏感或光化射线敏感性树脂组合物形成膜，其包含：（A）阳离子部分中含有氮原子的鎓盐化合物; （B）能够在用光化射线或辐射照射时能产生酸的化合物; 和（C）能够通过酸的作用增加极性以降低在含有有机溶剂的显影剂中的溶解性的树脂，使该膜曝光; 并通过使用含有有机溶剂的显影剂显影曝光的薄膜以形成负图案。
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