Invention Grant
- Patent Title: Integrated memory coplanar transmission line package having ground path that brackets data path to extend memory speeds
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Application No.: US16260623Application Date: 2019-01-29
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Publication No.: US11569161B2Publication Date: 2023-01-31
- Inventor: Chong Zhao , James McCall , Michael Gutzmann
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L27/108
Abstract:
Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, that comprises a bumpout region on a first surface of the package substrate, and a pin region on a second surface of the package substrate. In an embodiment, a data path from the bumpout region to the pin region is included in the electronic package. In an embodiment, a ground path brackets the data path from the bumpout region to the pin region.
Public/Granted literature
- US20200243433A1 INTEGRATED MEMORY COPLANAR TRANSMISSION LINE PACKAGE TO EXTEND MEMORY SPEEDS Public/Granted day:2020-07-30
Information query
IPC分类:
