公开(公告)号：US20170140809A1

公开(公告)日：2017-05-18

申请号：US15351195

申请日：2016-11-14

Applicant: Intel Corporation

Inventor： Christopher P. Mozak ,  Randy B. Osborne ,  Michael Gutzmann ,  James A. McCall

IPC: G11C11/4093 ,  G11C11/4096 ,  G11C11/4076

CPC classification number: G11C11/4093 ,  G06F13/1684 ,  G06F13/1689 ,  G11C11/4076 ,  G11C11/4096

Abstract: Methods and apparatus related to multiple rank high bandwidth memory are described. In one embodiment, a semiconductor package includes a high bandwidth memory with multiple ranks. Other embodiments are also disclosed and claimed.

公开(公告)号：US11569161B2

公开(公告)日：2023-01-31

申请号：US16260623

申请日：2019-01-29

Applicant: Intel Corporation

Inventor： Chong Zhao ,  James McCall ,  Michael Gutzmann

IPC: H01L23/498 ,  H01L27/108

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, that comprises a bumpout region on a first surface of the package substrate, and a pin region on a second surface of the package substrate. In an embodiment, a data path from the bumpout region to the pin region is included in the electronic package. In an embodiment, a ground path brackets the data path from the bumpout region to the pin region.

公开(公告)号：US10079052B2

公开(公告)日：2018-09-18

申请号：US15944755

申请日：2018-04-03

Applicant: Intel Corporation

Inventor： Christopher P. Mozak ,  Randy B. Osborne ,  Michael Gutzmann ,  James A. McCall

IPC: G11C8/00 ,  G11C11/4093 ,  G11C11/4076 ,  G11C11/4096

CPC classification number: G11C11/4093 ,  G06F13/1684 ,  G06F13/1689 ,  G11C11/4076 ,  G11C11/4096 ,  Y02D10/14

Abstract: Methods and apparatus related to multiple rank high bandwidth memory are described. In one embodiment, a semiconductor package includes a high bandwidth memory with multiple ranks. Other embodiments are also disclosed and claimed.

公开(公告)号：US09934842B2

公开(公告)日：2018-04-03

申请号：US15351195

申请日：2016-11-14

Applicant: Intel Corporation

Inventor： Christopher P. Mozak ,  Randy B. Osborne ,  Michael Gutzmann ,  James A. McCall

IPC: G11C8/00 ,  G11C11/4093 ,  G11C11/4076 ,  G11C11/4096

CPC classification number: G11C11/4093 ,  G06F13/1684 ,  G06F13/1689 ,  G11C11/4076 ,  G11C11/4096

Abstract: Methods and apparatus related to multiple rank high bandwidth memory are described. In one embodiment, a semiconductor package includes a high bandwidth memory with multiple ranks. Other embodiments are also disclosed and claimed.

公开(公告)号：US20180226118A1

公开(公告)日：2018-08-09

申请号：US15944755

申请日：2018-04-03

Applicant: Intel Corporation

Inventor： Christopher P. Mozak ,  Randy B. Osborne ,  Michael Gutzmann ,  James A. McCall

IPC: G11C11/4093 ,  G11C11/4076 ,  G11C11/4096

CPC classification number: G11C11/4093 ,  G06F13/1684 ,  G06F13/1689 ,  G11C11/4076 ,  G11C11/4096

Abstract: Methods and apparatus related to multiple rank high bandwidth memory are described. In one embodiment, a semiconductor package includes a high bandwidth memory with multiple ranks. Other embodiments are also disclosed and claimed.