Invention Grant
- Patent Title: Transfer head assembly and LED transfer apparatus
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Application No.: US16954438Application Date: 2018-09-20
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Publication No.: US11569409B2Publication Date: 2023-01-31
- Inventor: Seungjun Lee , Myungsoo Han , Kiyong Yang
- Applicant: LG Display Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: LG Display Co., Ltd.
- Current Assignee: LG Display Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Fenwick & West LLP
- Priority: KR10-2017-0176334 20171220
- International Application: PCT/KR2018/011179 WO 20180920
- International Announcement: WO2019/124685 WO 20190627
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L25/075 ; H01L21/67

Abstract:
Embodiments of the present disclosure relate to a transfer head assembly and an LED transfer apparatus, and more particularly, to a transfer head assembly and an LED transfer apparatus in which a plurality of pickup units picks up LEDs, which are adhered to the upper surfaces of the LEDs, and transfers the LEDs to a display substrate. According to the embodiments of the present disclosure, a large number of LEDs located on a wafer substrate or a carrier substrate can be transferred in bulk to a display substrate. Thus, it is possible to rapidly perform the transfer process of the LEDs.
Public/Granted literature
- US20210083142A1 TRANSFER HEAD ASSEMBLY AND LED TRANSFER APPARATUS Public/Granted day:2021-03-18
Information query
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