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公开(公告)号:US10446070B2
公开(公告)日:2019-10-15
申请号:US14818761
申请日:2015-08-05
Applicant: LG Display Co., Ltd.
Inventor: Jiah Kim , Juyoung Lee , Byeongseong So , Seungjun Lee
IPC: G09G3/20 , G09G3/3266 , G09G3/36 , G11C19/28
Abstract: Provided are a display device, a scan driver, and a method of manufacturing the same. A scan driver includes: a level shifter configured to output a power and a signal, and a scan signal generating circuit configured to generate a scan signal based on the power and the signal supplied from the level shifter, the scan signal generating circuit including a buffer configured to transmit a clock signal to a stage of a shift register, the buffer including two inverters, one of the two inverters being included in a multi-buffer.
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公开(公告)号:US10754471B2
公开(公告)日:2020-08-25
申请号:US16204539
申请日:2018-11-29
Applicant: LG DISPLAY CO., LTD.
Inventor: Seungjun Lee , Sangsoo Han , Sangmin Lee
Abstract: A touch sensing device and an image display device using the same are discussed. The touch sensing can include touch sensors included in an image display panel, a touch sensing circuit unit configured to supply a driving signal to the touch sensors, receive a touch voltage from the touch sensors and generate sensing data based on a touch sensing result of the image display panel, and a micro control unit configured to determine whether or not the plurality of touch sensors, the touch sensing circuit unit and a self-stored firmware operate normally when a power source of the touch sensing device is turned on, and allow a touch sensing operation to be operated normally or delay a reset operation in a predetermined period unit and repeatedly perform the reset operation in a predetermined delay period unit based on a result of previous determination.
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公开(公告)号:US11569409B2
公开(公告)日:2023-01-31
申请号:US16954438
申请日:2018-09-20
Applicant: LG Display Co., Ltd.
Inventor: Seungjun Lee , Myungsoo Han , Kiyong Yang
IPC: H01L33/00 , H01L25/075 , H01L21/67
Abstract: Embodiments of the present disclosure relate to a transfer head assembly and an LED transfer apparatus, and more particularly, to a transfer head assembly and an LED transfer apparatus in which a plurality of pickup units picks up LEDs, which are adhered to the upper surfaces of the LEDs, and transfers the LEDs to a display substrate. According to the embodiments of the present disclosure, a large number of LEDs located on a wafer substrate or a carrier substrate can be transferred in bulk to a display substrate. Thus, it is possible to rapidly perform the transfer process of the LEDs.
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公开(公告)号:US20210083142A1
公开(公告)日:2021-03-18
申请号:US16954438
申请日:2018-09-20
Applicant: LG Display Co., Ltd.
Inventor: Seungjun Lee , Myungsoo Han , Kiyong Yang
IPC: H01L33/00 , H01L25/075
Abstract: Embodiments of the present disclosure relate to a transfer head assembly and an LED transfer apparatus, and more particularly, to a transfer head assembly and an LED transfer apparatus in which a plurality of pickup units picks up LEDs, which are adhered to the upper surfaces of the LEDs, and transfers the LEDs to a display substrate. According to the embodiments of the present disclosure, a large number of LEDs located on a wafer substrate or a carrier substrate can be transferred in bulk to a display substrate. Thus, it is possible to rapidly perform the transfer process of the LEDs.
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