Touch sensing device and image display device using the same

    公开(公告)号:US10754471B2

    公开(公告)日:2020-08-25

    申请号:US16204539

    申请日:2018-11-29

    Abstract: A touch sensing device and an image display device using the same are discussed. The touch sensing can include touch sensors included in an image display panel, a touch sensing circuit unit configured to supply a driving signal to the touch sensors, receive a touch voltage from the touch sensors and generate sensing data based on a touch sensing result of the image display panel, and a micro control unit configured to determine whether or not the plurality of touch sensors, the touch sensing circuit unit and a self-stored firmware operate normally when a power source of the touch sensing device is turned on, and allow a touch sensing operation to be operated normally or delay a reset operation in a predetermined period unit and repeatedly perform the reset operation in a predetermined delay period unit based on a result of previous determination.

    Transfer head assembly and LED transfer apparatus

    公开(公告)号:US11569409B2

    公开(公告)日:2023-01-31

    申请号:US16954438

    申请日:2018-09-20

    Abstract: Embodiments of the present disclosure relate to a transfer head assembly and an LED transfer apparatus, and more particularly, to a transfer head assembly and an LED transfer apparatus in which a plurality of pickup units picks up LEDs, which are adhered to the upper surfaces of the LEDs, and transfers the LEDs to a display substrate. According to the embodiments of the present disclosure, a large number of LEDs located on a wafer substrate or a carrier substrate can be transferred in bulk to a display substrate. Thus, it is possible to rapidly perform the transfer process of the LEDs.

    TRANSFER HEAD ASSEMBLY AND LED TRANSFER APPARATUS

    公开(公告)号:US20210083142A1

    公开(公告)日:2021-03-18

    申请号:US16954438

    申请日:2018-09-20

    Abstract: Embodiments of the present disclosure relate to a transfer head assembly and an LED transfer apparatus, and more particularly, to a transfer head assembly and an LED transfer apparatus in which a plurality of pickup units picks up LEDs, which are adhered to the upper surfaces of the LEDs, and transfers the LEDs to a display substrate. According to the embodiments of the present disclosure, a large number of LEDs located on a wafer substrate or a carrier substrate can be transferred in bulk to a display substrate. Thus, it is possible to rapidly perform the transfer process of the LEDs.

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