Invention Grant
- Patent Title: Image sensor employing varied intra-frame analog binning
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Application No.: US17011227Application Date: 2020-09-03
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Publication No.: US11570384B2Publication Date: 2023-01-31
- Inventor: Shahaf Duenyas , Yoel Yaffe , Guy Horowitz , Amit Eisenberg , Shy Hamami , Oded Monzon , Gal Bitan , Yoav Piepsh
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Main IPC: H04N5/341
- IPC: H04N5/341 ; H04N5/343 ; H04N5/347

Abstract:
A method performed with an image sensor having a pixel array. At least one frame of a scene may be obtained using the pixel array. At least one region of interest (ROI) is identified within the frame. Subsequent frames of the scene are obtained, which involves controlling the pixel array to perform high resolution imaging with respect to the at least one ROI and low resolution imaging using analog binning with respect to remaining regions of the frames.
Public/Granted literature
- US20220070391A1 IMAGE SENSOR EMPLOYING VARIED INTRA-FRAME ANALOG BINNING Public/Granted day:2022-03-03
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