- 专利标题： Component embedded in component carrier and having an exposed side wall
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申请号： US16051618申请日： 2018-08-01
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公开(公告)号： US11570897B2公开(公告)日： 2023-01-31
- 发明人: Bettina Schuster , Jonathan Silvano de Sousa , Andreas Zluc , Markus Leitgeb , Hannes Stahr
- 申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 申请人地址： AT Leoben
- 专利权人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 当前专利权人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- 当前专利权人地址： AT Leoben
- 代理机构： Smith Tempel Blaha LLC
- 代理商 Robert A. Blaha
- 优先权： EP17185037 20170804
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K3/46 ; H05K3/00 ; H05K1/02
摘要：
A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.
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