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公开(公告)号：US10993313B2
公开(公告)日：2021-04-27
申请号：US16051204
申请日：2018-07-31
摘要： A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a non-uniform magnetic foil integrated in the stack.
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公开(公告)号：US10897308B2
公开(公告)日：2021-01-19
申请号：US16660652
申请日：2019-10-22
IPC分类号： H04B10/00 , H04B10/25 , H04B10/2575
摘要： An electronic device and a method for transmitting electromagnetic radiation are disclosed. The electronic device includes (a) a component carrier with a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; (b) a component embedded in the component carrier and configured for providing an electric radio frequency signal; (c) an antenna structure formed in the component carrier and configured for emitting electromagnetic radiation in response to receiving the provided electric radio frequency signal; and (d) a radiation lens formed in the component carrier and configured for spatially manipulating the emitted electromagnetic radiation and directing the spatially manipulated emitted electromagnetic radiation to an environment of the component carrier. Further described is an electronic device and a method for receiving electromagnetic radiation.
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公开(公告)号：US10782259B2
公开(公告)日：2020-09-22
申请号：US16195982
申请日：2018-11-20
摘要： A method and a sensor arrangement for determining a physical quantity are illustrated and described. The described method includes stimulating a capacitor device within a native component carrier; measuring a capacitance value of the capacitor device; and determining the physical quantity based on the measured capacitance value. Further described is a method for using a native component carrier as a transducer for detecting a value of a physical quantity.
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公开(公告)号：US20200245453A1
公开(公告)日：2020-07-30
申请号：US16740928
申请日：2020-01-13
摘要： A method of manufacturing a component carrier. The method includes forming a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and embedding a filament in the stack.
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公开(公告)号：US20190110367A1
公开(公告)日：2019-04-11
申请号：US16153199
申请日：2018-10-05
摘要： A component carrier and a method for manufacturing a component carrier is described wherein the component carrier includes a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures and a wiring structure on and/or in the layer structures where the wiring structure is at least partially formed as a three-dimensionally printed structure.
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公开(公告)号：US11570897B2
公开(公告)日：2023-01-31
申请号：US16051618
申请日：2018-08-01
摘要： A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.
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公开(公告)号：US10736222B2
公开(公告)日：2020-08-04
申请号：US16313924
申请日：2017-06-29
摘要： A component carrier includes component carrier material and a heat spreading module with a carbon structure enclosed within a dielectric shell for disabling contact between the carbon structure and the component carrier material.
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8.发明申请公开(公告)号：US20200153510A1
公开(公告)日：2020-05-14
申请号：US16660652
申请日：2019-10-22
IPC分类号： H04B10/00 , H04B10/2575
摘要： An electronic device and a method for transmitting electromagnetic radiation are disclosed. The electronic device includes (a) a component carrier with a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure; (b) a component embedded in the component carrier and configured for providing an electric radio frequency signal; (c) an antenna structure formed in the component carrier and configured for emitting electromagnetic radiation in response to receiving the provided electric radio frequency signal; and (d) a radiation lens formed in the component carrier and configured for spatially manipulating the emitted electromagnetic radiation and directing the spatially manipulated emitted electromagnetic radiation to an environment of the component carrier. Further described is an electronic device and a method for receiving electromagnetic radiation.
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9.发明申请公开(公告)号：US20180096912A1
公开(公告)日：2018-04-05
申请号：US15721116
申请日：2017-09-29
发明人： Jonathan Silvano de Sousa , Bernhard Reitmaier , Erich Schlaffer , Johannes Stahr , Wolfgang Schrittwieser , Gerald Weidinger , Alexander Kasper , Gernot Grober
IPC分类号： H01L23/427 , F28D15/02 , H01L21/673 , F28D20/02 , F28F3/08 , F21V29/51
CPC分类号： H01L23/427 , F21V29/51 , F28D15/0275 , F28D20/023 , F28F3/086 , H01L21/673 , H05K1/0203 , H05K1/0206 , H05K1/0207 , H05K1/0272 , H05K2201/064
摘要： The invention refers to a component carrier comprising at least one heat pipe, wherein the at least one heat pipe has at least a largely cylindrical heat pipe section with a largely cylindrical profile with an outer diameter. The at least one heat pipe is embedded within a recess of at least one inner layer or is surface-mounted on an outer layer of said component carrier, wherein at least the largely cylindrical heat pipe section of the heat pipe is thermoconductively coupled by means of at least one adapter means that directly contacts the heat pipe with at least one layer of the component carrier. Furthermore the invention refers to several methods for producing said component carrier.
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公开(公告)号：US11659648B2
公开(公告)日：2023-05-23
申请号：US16152659
申请日：2018-10-05
IPC分类号： H05K1/02 , H05K1/09 , H05K1/03 , H05K3/46 , H05K1/18 , B22F7/08 , B33Y80/00 , B33Y10/00 , H05K3/12 , B22F10/20
CPC分类号： H05K1/0206 , B22F7/08 , B33Y10/00 , B33Y80/00 , H05K1/021 , H05K1/0209 , H05K1/0353 , H05K1/09 , H05K1/181 , H05K1/185 , H05K3/1241 , H05K3/4644 , H05K3/4664 , B22F10/20 , H05K2201/064 , H05K2201/066 , H05K2203/0126 , H05K2203/0195 , H05K2203/107
摘要： A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.
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