公开(公告)号：US20190124772A1

公开(公告)日：2019-04-25

申请号：US16169741

申请日：2018-10-24

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Hannes Stahr ,  Hannes Voraberger ,  Andreas Zluc ,  Bettina Schuster

IPC分类号： H05K1/18 ,  H05K3/40 ,  H05K3/34 ,  H05K1/11

摘要： A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.

公开(公告)号：US11570897B2

公开(公告)日：2023-01-31

申请号：US16051618

申请日：2018-08-01

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Bettina Schuster ,  Jonathan Silvano de Sousa ,  Andreas Zluc ,  Markus Leitgeb ,  Hannes Stahr

IPC分类号： H05K1/18 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02

摘要： A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.

公开(公告)号：US20190045636A1

公开(公告)日：2019-02-07

申请号：US16051618

申请日：2018-08-01

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Bettina Schuster ,  Jonathan Silvano de Sousa ,  Andreas Zluc ,  Markus Leitgeb ,  Hannes Stahr

IPC分类号： H05K1/18 ,  H05K3/46

摘要： A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a component embedded in the stack, wherein at least a portion of a side wall of the component is exposed.

公开(公告)号：US10765005B2

公开(公告)日：2020-09-01

申请号：US16169741

申请日：2018-10-24

申请人： AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Hannes Stahr ,  Hannes Voraberger ,  Andreas Zluc ,  Bettina Schuster

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H01L23/00 ,  H05K3/00 ,  H01L23/538

摘要： A method of manufacturing a component carrier is disclosed. The method includes galvanically depositing at least part of at least one electrically conductive pillar on a component, and inserting the at least one electrically conductive pillar and an electrically insulating layer structure into one another.