发明授权
- 专利标题： Microwave integrated quantum circuits with vias and methods for making the same
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申请号： US16936187申请日： 2020-07-22
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公开(公告)号： US11574230B1公开(公告)日： 2023-02-07
- 发明人: Chad Tyler Rigetti , Dane Christoffer Thompson , Alexei N. Marchenkov , Mehrnoosh Vahidpour , Eyob A. Sete , Matthew J. Reagor
- 申请人： Rigetti & Co, LLC
- 申请人地址： US CA Berkeley
- 专利权人： Rigetti & Co, LLC
- 当前专利权人： Rigetti & Co, LLC
- 当前专利权人地址： US CA Berkeley
- 代理机构： Henry Patent Law Firm PLLC
- 主分类号： H01L39/04
- IPC分类号： H01L39/04 ; H01L21/768 ; H01L39/22 ; G06N10/00 ; H01L27/18 ; B82Y10/00
摘要：
A quantum computing system that includes a quantum circuit device having at least one operating frequency; a first substrate having a first surface on which the quantum circuit device is disposed; a second substrate having a first surface that defines a recess of the second substrate, the first and second substrates being arranged such that the recess of the second substrate forms an enclosure that houses the quantum circuit device; and an electrically conducting layer that covers at least a portion of the recess of the second substrate.
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