Invention Grant
- Patent Title: Dielectric powder and multilayer capacitor using the same
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Application No.: US17133828Application Date: 2020-12-24
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Publication No.: US11574775B2Publication Date: 2023-02-07
- Inventor: Chang Hwa Park , Jin Woo Kim , Min Gi Sin , Byung Hyun Park , Chin Mo Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0180989 20161228
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01L21/02 ; H01G4/12 ; H01L49/02 ; H01G4/10 ; C01G23/00 ; H01L23/29 ; C01F11/02 ; C01G23/047
Abstract:
A dielectric powder includes a core-shell structure including a core region formed in an inner portion thereof and a shell region covering the core region. The core region includes barium titanate (BaTiO3) doped with a metal oxide, and the shell region is formed of a ferroelectric material.
Public/Granted literature
- US20210151257A1 DIELECTRIC POWDER AND MULTILAYER CAPACITOR USING THE SAME Public/Granted day:2021-05-20
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