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    Multilayer ceramic capacitor
    1.
    发明授权
    Multilayer ceramic capacitor 有权

    公开(公告)号：US12087511B2

    公开(公告)日：2024-09-10

    申请号：US17852549

    申请日：2022-06-29

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Jong Myeong Jeon ,  Ki Yong Lee ,  Jin Woo Kim ,  Chang Hak Choi

    IPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/12

    CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/1227

    摘要： A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces. A plurality of internal electrodes is disposed inside the ceramic body, connected to the first and second surfaces, and have one ends connected to the third and fourth surfaces. First and second side margin parts are disposed on end portions of the internal electrodes connected to the first and second surfaces. The ceramic body includes an active portion forming capacitance by including the plurality of internal electrodes disposed to oppose each other with the dielectric layer interposed therebetween. An average Sn content in a region adjacent to the side margin part of the active portion is greater than an average Sn content in a central region of the active portion.

    CERAMIC ELECTRONIC COMPONENT
    4.
    发明申请
    CERAMIC ELECTRONIC COMPONENT 有权

    公开(公告)号：US20220399165A1

    公开(公告)日：2022-12-15

    申请号：US17740769

    申请日：2022-05-10

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Jin Woo Kim ,  Chang Hak Choi ,  Seok Hyun Yoon ,  Ki Yong Lee ,  Jong Myeong Jeon

    IPC分类号： H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30

    摘要： A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.

    MULTILAYER ELECTRONIC COMPONENT
    8.
    发明公开
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20240203649A1

    公开(公告)日：2024-06-20

    申请号：US18123027

    申请日：2023-03-17

    申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

    发明人： Hee Sun Chun ,  Jin Woo Kim ,  Tae Hyung Kim ,  Hyo Ju Lee ,  Seok Hyun Yoon ,  Jeong Ryeol Kim

    IPC分类号： H01G4/12 ,  C04B35/468 ,  H01G4/012 ,  H01G4/30

    CPC分类号： H01G4/1227 ,  C04B35/4682 ,  H01G4/012 ,  H01G4/30 ,  C04B2235/78

    摘要： A multilayer electronic component includes a body including a dielectric layer including a plurality of dielectric grains and internal electrodes alternately disposed with the dielectric layer in a first direction and external electrodes disposed on the body, wherein at least one of the plurality of dielectric grains has a core-shell structure including an inner core and a shell covering at least a portion of the core, a ratio of an average size of the core to an average size of the dielectric grains having the core-shell structure is 0.4 or more and 0.8 or less, a ratio ((Dy+Tb)/Sn) of the sum of the moles of dysprosium (Dy) and the moles of terbium (Tb) to the moles of tin (Sn) included in the dielectric layer satisfies 0.7 or more and 1.5 or less, and at least one of the dielectric layers has four or more dielectric grains in the first direction.