- 专利标题: Manufacturing method of semiconductor device
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申请号: US17254426申请日: 2019-06-19
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公开(公告)号: US11581427B2公开(公告)日: 2023-02-14
- 发明人: Junichi Koezuka , Masami Jintyou , Takahiro Iguchi , Yasutaka Nakazawa
- 申请人: Semiconductor Energy Laboratory Co., Ltd.
- 申请人地址: JP Atsugi
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi
- 代理机构: Robinson Intellectual Property Law Office
- 代理商 Eric J. Robinson
- 优先权: JPJP2018-123991 20180629
- 国际申请: PCT/IB2019/055127 WO 20190619
- 国际公布: WO2020/003055 WO 20200102
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L29/66 ; H01L21/383 ; H01L21/4757 ; H01L29/786 ; G02F1/1368 ; H01L21/465 ; H01L27/12 ; H01L27/32 ; H01L29/423
摘要:
A semiconductor device with favorable electrical characteristics is provided. A semiconductor device with stable electrical characteristics is provided. A highly reliable semiconductor device is provided. A semiconductor layer is formed, a gate insulating layer is formed over the semiconductor layer, a metal oxide layer is formed over the gate insulating layer, and a gate electrode which overlaps with part of the semiconductor layer is formed over the metal oxide layer. Then, a first element is supplied through the metal oxide layer and the gate insulating layer to a region of the semiconductor layer that does not overlap with the gate electrode. Examples of the first element include phosphorus, boron, magnesium, aluminum, and silicon. The metal oxide layer may be processed after the first element is supplied to the semiconductor layer.
公开/授权文献
- US20210126115A1 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE 公开/授权日:2021-04-29
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