Invention Grant
- Patent Title: Component mounting system and tape scraps collecting device
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Application No.: US17647196Application Date: 2022-01-06
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Publication No.: US11584552B2Publication Date: 2023-02-21
- Inventor: Hiroki Kobayashi , Naoki Azuma , Chikara Takata , Yuzo Asano , Toru Chikuma , Hiroshi Satoh
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-079725 20180418,JPJP2018-079726 20180418
- Main IPC: H05K13/02
- IPC: H05K13/02 ; H05K13/04 ; B65G47/68 ; B65B15/04

Abstract:
A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
Public/Granted literature
- US20220127028A1 COMPONENT MOUNTING SYSTEM AND TAPE SCRAPS COLLECTING DEVICE Public/Granted day:2022-04-28
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