Invention Grant
- Patent Title: Thermoplastic resin composition
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Application No.: US16768631Application Date: 2019-01-10
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Publication No.: US11584849B2Publication Date: 2023-02-21
- Inventor: Jae Yeon Bae , Ki Young Nam , Je Sun Yoo , Jae Yong Sim , Seon Hyeong Bae , In Seok Kim
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Priority: KR10-2018-0003197 20180110,KR10-2019-0002852 20190109
- International Application: PCT/KR2019/000416 WO 20190110
- International Announcement: WO2019/139386 WO 20190718
- Main IPC: C08L55/02
- IPC: C08L55/02 ; C08G63/183 ; C08G63/189 ; C08G63/199 ; C08G63/672 ; C08K3/22 ; C08K5/00 ; C08L25/12

Abstract:
A thermoplastic resin composition includes a first copolymer including a conjugated diene-based polymer, a unit derived from an aromatic vinyl-based monomer, and a unit derived from a vinyl cyan-based monomer; a second copolymer including a unit derived from an aromatic vinyl-based monomer and a unit derived from a vinyl cyan-based monomer; and, with respect to 100 parts by weight of the sum of the first copolymer and the second copolymer, 2.0 to 10 parts by weight of a third copolymer having a soft segment including a unit derived from a polyalkylene glycol and a hard segment including unit derived from an aromatic dicarboxylic acid or aromatic dicarboxylate and a unit derived from a linear aliphatic diol; and 2.5 to 10 parts by weight of a fourth copolymer including an aromatic dicarboxylic acid-derived unit, a unit derived from a linear aliphatic diol, and a unit derived from a cyclic aliphatic diol.
Public/Granted literature
- US20210171761A1 THERMOPLASTIC RESIN COMPOSITION Public/Granted day:2021-06-10
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