Invention Grant
- Patent Title: Semiconductor device package
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Application No.: US16809506Application Date: 2020-03-04
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Publication No.: US11588081B2Publication Date: 2023-02-21
- Inventor: Hsin-Ying Ho , Hsun-Wei Chan , Shih-Chieh Tang , Lu-Ming Lai
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L33/58
- IPC: H01L33/58

Abstract:
A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.
Public/Granted literature
- US20210280755A1 SEMICONDUCTOR DEVICE PACKAGE Public/Granted day:2021-09-09
Information query
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