公开(公告)号：US11965905B2

公开(公告)日：2024-04-23

申请号：US17559943

申请日：2021-12-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh Tang

IPC: G01P15/093 ,  G01H9/00 ,  G02B6/42

CPC classification number: G01P15/093 ,  G01H9/006 ,  G02B6/4246

Abstract: An electronic module is provided. The electronic module includes a carrier, a movable component and an optical component. The movable component is on the carrier and configured to be movable with respect to the carrier. The optical component is configured to detect a movement of the movable component by an optical coupling between the optical component and the movable component.

公开(公告)号：US11276720B2

公开(公告)日：2022-03-15

申请号：US16670836

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh Tang ,  Lu-Ming Lai ,  Chia Yun Hsu

IPC: H01L27/146

Abstract: An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.

公开(公告)号：US10720751B2

公开(公告)日：2020-07-21

申请号：US16118228

申请日：2018-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan Tsai ,  Lu-Ming Lai ,  Ying-Chung Chen ,  Shih-Chieh Tang

IPC: G02B6/02 ,  H04B10/50 ,  G02B6/35 ,  G02B6/42 ,  H04B10/80 ,  H01S5/022 ,  H01L31/0203 ,  H01L33/62 ,  H01L23/00 ,  H01L23/538 ,  H01S5/40 ,  H01L33/48 ,  H01S5/02 ,  H01L25/075 ,  H01S5/183 ,  H01L25/04 ,  H01L31/02 ,  H01L25/16

Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.

公开(公告)号：US11588081B2

公开(公告)日：2023-02-21

申请号：US16809506

申请日：2020-03-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan ,  Shih-Chieh Tang ,  Lu-Ming Lai

IPC: H01L33/58

Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.

公开(公告)号：US10818816B2

公开(公告)日：2020-10-27

申请号：US15821302

申请日：2017-11-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Lu-Ming Lai ,  Shih-Chieh Tang

IPC: H01L27/146 ,  H01L31/0232 ,  H01L31/105 ,  H01L31/173 ,  H01L27/15 ,  H01L31/02 ,  G06K9/00 ,  H01L33/20

Abstract: An optical device includes a substrate, a plurality of light emitting devices, a photo detector and a circuit layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a first region and a second region. The light emitting devices are disposed on the first surface in the first region of the substrate. The photo detector is disposed in the second region of the substrate. The photo detector includes an electrical contact exposed from the second surface of the substrate. The circuit layer is disposed on the second surface of the substrate and electrically connected to the electrical contact of the photo detector.

公开(公告)号：US12085768B2

公开(公告)日：2024-09-10

申请号：US17465713

申请日：2021-09-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh Tang ,  Lu-Ming Lai ,  Yu-Che Huang ,  Ying-Chung Chen

IPC: G02B6/42

CPC classification number: G02B6/4215 ,  G02B6/4214

Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

公开(公告)号：US11296025B2

公开(公告)日：2022-04-05

申请号：US16514962

申请日：2019-07-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsun-Wei Chan ,  Shih-Chieh Tang

IPC: H01L23/528 ,  H05K1/18

Abstract: A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.

公开(公告)号：US11276806B2

公开(公告)日：2022-03-15

申请号：US16734046

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen Chiang ,  Kuang-Hsiung Chen ,  Lu-Ming Lai ,  Hsun-Wei Chan ,  Hsin-Ying Ho ,  Shih-Chieh Tang

IPC: H01L33/54 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62 ,  H01L31/0232

Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.

公开(公告)号：US10862014B2

公开(公告)日：2020-12-08

申请号：US14939331

申请日：2015-11-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Shih-Chieh Tang

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/46 ,  H01L33/48 ,  H01L33/62

Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.