Invention Grant
- Patent Title: Ceramic interposers for on-die interconnects
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Application No.: US16921469Application Date: 2020-07-06
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Publication No.: US11594493B2Publication Date: 2023-02-28
- Inventor: Digvijay Ashokkumar Raorane
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L23/31 ; H01L23/15 ; H01L25/065 ; H01L23/367 ; H01L25/00 ; H01L23/00 ; H01L21/48 ; H01L21/56
Abstract:
Ceramic interposers in a disaggregated-die semiconductor package allow for useful signal integrity and interconnecting components. Low-loss ceramics are used to tune ceramic interposers for a die assembly that may have components from different process-technology nodes.
Public/Granted literature
- US20210028117A1 CERAMIC INTERPOSERS FOR ON-DIE INTERCONNECTS Public/Granted day:2021-01-28
Information query
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