Invention Grant
- Patent Title: Ultrasonic device and ultrasonic sensor
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Application No.: US16681980Application Date: 2019-11-13
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Publication No.: US11594671B2Publication Date: 2023-02-28
- Inventor: Koji Ohashi , Hironori Suzuki , Chikara Kojima
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2018-213386 20181114
- Main IPC: H01L41/113
- IPC: H01L41/113 ; B06B1/06 ; H04R17/00 ; G01H11/08 ; G01S15/08 ; G01S15/42 ; G01S3/808 ; H02N2/00

Abstract:
An ultrasonic device according to an aspect of the present disclosure includes a substrate in which an opening section piercing through the substrate in a thickness direction is provided, a vibration plate provided on the substrate to close the opening section, a piezoelectric element provided in a position corresponding to the opening section on a first surface at the opposite side of the substrate side of the vibration plate, and an elastic layer provided in contact with a second surface at the substrate side of the vibration plate at the inner side of the opening section of the substrate. The elastic layer includes a curved surface recessed to the vibration plate side at the opposite side of the vibration plate side.
Public/Granted literature
- US20200152857A1 ULTRASONIC DEVICE AND ULTRASONIC SENSOR Public/Granted day:2020-05-14
Information query
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