公开(公告)号：US20240344879A1

公开(公告)日：2024-10-17

申请号：US18294620

申请日：2021-02-25

申请人： GEEGAH LLC

发明人： Amit Lal ,  Jusin Kuo

IPC分类号： G01H11/08 ,  B06B1/06 ,  G01H15/00

CPC分类号： G01H11/08 ,  B06B1/0688 ,  G01H15/00

摘要： A system and/or method for RF interrogation to read surface properties such as ultrasonic impedance and temperature in the field of measuring signals at a distance. The system includes a substrate with one or more piezoelectric transducers, at least one antenna connected to the substrate or formed onto the substrate, and one or more antenna terminals extending from the antenna and connected to terminals of at least one piezoelectric transducer. The antenna receives a radio frequency pulse and actuates at least one piezoelectric transducer. The piezoelectric transducer generates an ultrasonic pulse that reflects off a back side of the substrate. The reflected ultrasonic pulse is received at the piezoelectric transducer and drives the antenna that initially received the radio frequency pulse.

公开(公告)号：US12117100B2

公开(公告)日：2024-10-15

申请号：US17758183

申请日：2020-01-03

申请人： Carlos Maria Ortega ,  Iris Monica Rabboni ,  Gustavo Alejandro Mutz

发明人： Carlos Maria Ortega ,  Iris Monica Rabboni ,  Gustavo Alejandro Mutz

IPC分类号： G01N29/14 ,  F16K37/00 ,  G01H11/08 ,  G01M3/24

CPC分类号： F16K37/0083 ,  G01H11/08 ,  G01M3/24 ,  G01N29/14

摘要： Data retrieval, event recording and transmission module connectable to safety and relief valves. The module (10) coupled to safety or relief valves for the measurement, transmission and recording of events and includes a rigid and inextensible at room temperature longitudinal element defining an acoustic emission waveguide (12) that transmits vibrations. The end (12a) of (12) is in intimate contact with a portion (2) or (1) of the valve, and its other end (12b) penetrates inside a closed resistant box (10), wherein it sits in contact against at least one acoustic emission sensor (13) receiving a signal proportional to the vibrations transmitted by the waveguide (12).

公开(公告)号：US12078525B2

公开(公告)日：2024-09-03

申请号：US17699256

申请日：2022-03-21

申请人： Harman International Industries, Incorporated

发明人： Yu Du ,  Darin Krajewski

IPC分类号： G01H11/08 ,  B60R1/12 ,  G01H1/12 ,  H10N30/30 ,  H10N30/88

CPC分类号： G01H11/08 ,  B60R1/12 ,  G01H1/12 ,  H10N30/302 ,  H10N30/88 ,  B60R2001/1223

摘要： A vibration sensor assembly having a rigid surface and a transducer integrated with the rigid surface. The transducer measures structure-borne sound waves that cause vibration motion of the rigid surface. The rigid surface may be glass, metal or plastic and may be part of an interior part or panel, or an exterior panel, of a vehicle.

公开(公告)号：US12072229B2

公开(公告)日：2024-08-27

申请号：US17462090

申请日：2021-08-31

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Michael Zwerg ,  Sudhanshu Khanna ,  Steven C. Bartling ,  Brian Elies ,  Krishnasawamy Nagaraj ,  Wei-Yan Shih

IPC分类号： G01H11/08

CPC分类号： G01H11/08

摘要： In described examples, each node between adjacent capacitive elements of a stack of series-coupled capacitive elements is biased during a reset mode, where each of the capacitive elements includes piezoelectric material. A strain-induced voltage is generated across each of the capacitive elements. Each of the strain-induced voltages is combined to generate a piezoelectric-responsive output signal during a sensing mode at a time different from the time of the reset mode.

公开(公告)号：US20240159583A1

公开(公告)日：2024-05-16

申请号：US18548476

申请日：2022-03-04

申请人： PIEMACS SÀRL

发明人： Paul MURALT ,  Ramin MATLOUB ,  Robin NIGON

IPC分类号： G01H11/08 ,  H10N30/30 ,  H10N30/88

CPC分类号： G01H11/08 ,  H10N30/302 ,  H10N30/883

摘要： A vibration sensor based on piezoelectric thin films, or smart cuts of piezoelectric materials, integrated into a functional, metallic housing that transmits vibration deformations applied to the housing correctly into the sensor in a frequency range that is typically—but not limited to—1 Hz to 20 kHz. The sensor comprises a low-stiffness layer, for instance a PCB layer, providing a controllable contact force between sensor structure machine parts, and transforming the relative movements into a mechanical stress acting onto the piezoelectric layer.

公开(公告)号：US20240151576A1

公开(公告)日：2024-05-09

申请号：US18417006

申请日：2024-01-19

申请人： GOERTEK MICROELECTRONICS INC.

发明人： Luyu Duanmu ,  Junyu Tian ,  Huabin Fang

IPC分类号： G01H11/08

CPC分类号： G01H11/08 ,  H04R7/00 ,  H04R2201/003

摘要： Disclosed are a vibration sensor and an electronic equipment. The vibration sensor includes a circuit board assembly, a shell, a vibration pick-up assembly, a support shell and a chip assembly. The shell is configured to cover a side of the circuit board assembly to form an installation space. The vibration pick-up assembly is provided in the installation space, and is configured to pick up an external bone vibration and generate a response vibration. The support shell is connected to a side of the vibration pick-up assembly away from the circuit board assembly. The chip assembly is connected to a side of the support shell away from the circuit board assembly, and is electrically connected to the circuit board assembly. The vibration pick-up assembly, the support shell and the chip assembly are enclosed to form a conduction cavity.

公开(公告)号：US20240077386A1

公开(公告)日：2024-03-07

申请号：US18455743

申请日：2023-08-25

申请人： Aktiebolaget SKF

发明人： Olivier CHEVE ,  Charlotte VU

IPC分类号： G01M17/013 ,  G01H11/08

CPC分类号： G01M17/013 ,  G01H11/08

摘要： A sensor module (8) for detecting a mechanical vibration of a component (4). The sensor module (8) includes a base (12) having a central portion (24), a first end portion (26) and a second end portion (28). The base (12) secures to the component (4). At least one spacer (14) is connected to the base (12). A circuit board (18) is connected to the base (12) by the at least one spacer (14). The central portion (24) of the base (12) is provided with a concave edge (52) and with an opposite convex edge (54) defining the width of the central portion (24). The at least one spacer (14) is connected to the central portion (24) of the base (12) closer to the concave edge (52) than the convex edge (54).

公开(公告)号：US11874159B2

公开(公告)日：2024-01-16

申请号：US17616985

申请日：2020-07-21

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Tomoki Masuda ,  Yudai Ishizaki ,  Hidetomo Nagahara

IPC分类号： G01H11/08 ,  H04R17/00

CPC分类号： G01H11/08 ,  H04R17/00

摘要： Ultrasonic sensor (1) includes piezoelectric element (7), first acoustic matching layer (2), and second acoustic matching layer (5) which are laminated and bonded together, piezoelectric element (7) having a rectangular bonding surface. First acoustic matching layer (2), which is adjacent to piezoelectric element (7), is bonded to piezoelectric element (7) using thermoplastic resin injected from a thickness direction of first acoustic matching layer (2) in a manner that a flow direction of the thermoplastic resin matches a longitudinal direction of piezoelectric element (7). With this configuration, ultrasonic sensor (1) that exhibits excellent temperature characteristics against such as thermal shock is provided.

公开(公告)号：US20230417594A1

公开(公告)日：2023-12-28

申请号：US18243709

申请日：2023-09-08

申请人： Murata Manufacturing Co., Ltd.

发明人： Tomoaki MATSUSHITA

IPC分类号： G01H11/08

CPC分类号： G01H11/08

摘要： An ultrasonic sensor includes a case including a cylindrical side wall and a bottom plate in one end portion of the side wall, and a piezoelectric element on the bottom plate inside the case. The side wall includes a pair of thick wall portions facing each other and a pair of thin wall portions thinner than the thick wall portions facing each other. An inner peripheral edge of another end portion of the side wall includes a chamfered portion. The chamfered portion of one of the pair of thin wall portions includes a recessed portion.

公开(公告)号：US11808779B2

公开(公告)日：2023-11-07

申请号：US17305427

申请日：2021-07-07

申请人： NXP B.V.

发明人： Nikita Veshchikov ,  Arnold Braine

IPC分类号： G01H1/14 ,  G01H11/08 ,  G01H17/00 ,  G01P15/093 ,  G01P15/097 ,  G01L5/04 ,  G06F18/00

CPC分类号： G01P15/097 ,  G01H1/14 ,  G01H11/08 ,  G01H17/00 ,  G01L5/042 ,  G01P15/093 ,  G06F18/00 ,  G06F2218/12

摘要： A method is provided for identifying or authenticating an object. The method includes vibrating the object at a plurality of frequencies. The vibrations from the object are sensed at each of the plurality of frequencies using an accelerometer. A vibration profile of the object is generated using the sensed vibrations. The generated vibration profile is then compared to a stored vibration profile. It is determined if the generated vibration profile matches the stored vibration profile. A match indicates that the object has been identified or authenticated. In another embodiment, an object capable of implementing the method is provided. In another embodiment, the object may include a replaceable accessary. In this case, the initial and generated vibration profiles may be created with the replacement accessary attached to the object. A match of the generated and initial vibration profiles indicates that the replaceable accessary is authentic.