Invention Grant
- Patent Title: Discrete antenna module with via wall structure
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Application No.: US17119638Application Date: 2020-12-11
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Publication No.: US11594823B2Publication Date: 2023-02-28
- Inventor: Taesik Yang , Mohammad Ali Tassoudji , Jeongil Jay Kim , Darryl Sheldon Jessie , Kevin Hsi-Huai Wang
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Sunstein LLP
- Main IPC: H01Q21/00
- IPC: H01Q21/00 ; H01Q21/06 ; H01Q5/307 ; H01Q1/24 ; H01Q19/10 ; H01Q1/48 ; H01Q21/10

Abstract:
Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.
Public/Granted literature
- US20220190485A1 DISCRETE ANTENNA MODULE WITH VIA WALL STRUCTURE Public/Granted day:2022-06-16
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