公开(公告)号：US20210410274A1

公开(公告)日：2021-12-30

申请号：US17100121

申请日：2020-11-20

Applicant: QUALCOMM Incorporated

Inventor： Jeahyeong Han ,  Suhyung Hwang ,  Mina Iskander ,  Rajneesh Kumar ,  Darryl Sheldon Jessie

IPC: H05K1/02 ,  H01Q21/06 ,  H01Q1/48 ,  H01Q1/22

Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

公开(公告)号：US12119558B2

公开(公告)日：2024-10-15

申请号：US18174470

申请日：2023-02-24

Applicant: QUALCOMM Incorporated

Inventor： Julio Zegarra ,  Peter Lien ,  Sang-June Park ,  Darryl Sheldon Jessie ,  Alberto Cicalini ,  Sean Oak ,  Neil Burns

IPC: H01Q23/00 ,  H01Q1/48 ,  H01Q1/52 ,  H05K1/18

CPC classification number: H01Q23/00 ,  H01Q1/48 ,  H01Q1/526 ,  H05K1/189

Abstract: An integrated millimeter wave antenna module may include at least one antenna array connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

公开(公告)号：US11735819B2

公开(公告)日：2023-08-22

申请号：US17075098

申请日：2020-10-20

Applicant: QUALCOMM Incorporated

Inventor： Jeongil Jay Kim ,  Sangkil Kim ,  Darryl Sheldon Jessie

IPC: H01Q5/40 ,  H01Q9/06 ,  H01Q9/04

CPC classification number: H01Q5/40 ,  H01Q9/0407 ,  H01Q9/065

Abstract: Various wireless device and antenna array configurations are provided. An example wireless device includes at least one radio frequency integrated circuit, at least one patch antenna element operably coupled to the at least one radio frequency integrated circuit, at least one dipole antenna comprising two dipole antenna elements disposed adjacent to the at least one patch antenna element and operably coupled to the at least one radio frequency integrated circuit, and at least one high impedance surface disposed below the at least one dipole antenna and adjacent to the at least one patch antenna element.

公开(公告)号：US12212082B2

公开(公告)日：2025-01-28

申请号：US17951924

申请日：2022-09-23

Applicant: QUALCOMM Incorporated

Inventor： Mahmoud Niroo Jazi ,  Mohammad Ali Tassoudji ,  Taesik Yang ,  Jeongil Jay Kim ,  Darryl Sheldon Jessie ,  Kevin Hsi-Huai Wang ,  Jorge Fabrega Sanchez ,  Hong-Ming Lee

IPC: H01Q9/04 ,  H01Q9/16 ,  H01Q1/24

Abstract: An antenna system includes: a patch antenna element disposed at a first level of the antenna system; an energy coupler configured and coupled to the patch antenna element to transfer energy between the patch antenna element and a front-end circuit; a ground conductor disposed at a second level of the antenna system, the patch antenna element and the ground conductor being disposed a separation distance away from each other and bounding respective sides of a volume defined by a projection, normal to a surface of the patch antenna element, of the patch antenna element to the ground conductor; and a floating conductor that is displaced from the ground conductor and the patch antenna element, the floating conductor comprising a body extending over a portion of the separation distance outside of, and in close proximity to, the volume.

公开(公告)号：US11735804B2

公开(公告)日：2023-08-22

申请号：US16871822

申请日：2020-05-11

Applicant: QUALCOMM Incorporated

Inventor： Chaoqi Zhang ,  Suhyung Hwang ,  Jaehyun Yeon ,  Taesik Yang ,  Jeongil Jay Kim ,  Darryl Sheldon Jessie ,  Mohammad Ali Tassoudji

IPC: H01Q1/38 ,  H01Q1/12 ,  H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC classification number: H01Q1/12 ,  H05K1/0243 ,  H05K3/0047 ,  H05K3/4644 ,  H05K2201/10098

Abstract: A multi-core broadband printed circuit board (PCB) antenna and methods for fabricating such an antenna are provided. One example antenna implemented with a multi-core PCB generally includes a first core structure, a second core structure disposed above the first core structure, and one or more metal layers disposed above the second core structure or below the first core structure. The first core structure includes a first core layer, a first metal layer disposed below the first core layer, and a second metal layer disposed above the first core layer. The second core structure includes a second core layer, a third metal layer disposed below the second core layer, and a fourth metal layer disposed above the second core layer. The first core layer and the second core layer may have different thicknesses.

公开(公告)号：US11594824B2

公开(公告)日：2023-02-28

申请号：US16825615

申请日：2020-03-20

Applicant: QUALCOMM Incorporated

Inventor： Julio Zegarra ,  Peter Lien ,  Sang-June Park ,  Darryl Sheldon Jessie ,  Alberto Cicalini ,  Sean Oak ,  Neil Burns

IPC: H01Q1/52 ,  H01Q23/00 ,  H01Q1/48 ,  H05K1/18

Abstract: An integrated millimeter wave antenna module may include at least one antenna array directly connected to a wiring board with a flexible printed circuit without any additional connectors. The integrated module may include an antenna, a flexible printed circuit attached to the antenna on one end and a wiring board on the other end.

公开(公告)号：US12293980B2

公开(公告)日：2025-05-06

申请号：US16870642

申请日：2020-05-08

Applicant: QUALCOMM Incorporated

Inventor： Jaehyun Yeon ,  Suhyung Hwang ,  Chin-Kwan Kim ,  Rajneesh Kumar ,  Darryl Sheldon Jessie

IPC: H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/552 ,  H01Q1/22 ,  H01Q1/52 ,  H01Q5/307 ,  H01Q9/16 ,  H01Q21/06

Abstract: A package comprising a substrate, a first antenna device, and an integrated device. The substrate comprising a first surface and a second surface, where the substrate comprises a plurality of interconnects. The first antenna device is coupled to the first surface of the substrate, through a first plurality of solder interconnects. The integrated device is coupled to the second surface of the substrate. The package may include an encapsulation layer located over the second surface of the substrate, where the encapsulation layer encapsulates the integrated device. The package may include a shield formed over a surface of the encapsulation layer, where the shield includes an electromagnetic interference (EMI) shield.

公开(公告)号：US11594823B2

公开(公告)日：2023-02-28

申请号：US17119638

申请日：2020-12-11

Applicant: QUALCOMM Incorporated

Inventor： Taesik Yang ,  Mohammad Ali Tassoudji ,  Jeongil Jay Kim ,  Darryl Sheldon Jessie ,  Kevin Hsi-Huai Wang

IPC: H01Q21/00 ,  H01Q21/06 ,  H01Q5/307 ,  H01Q1/24 ,  H01Q19/10 ,  H01Q1/48 ,  H01Q21/10

Abstract: Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.

公开(公告)号：US20220368359A1

公开(公告)日：2022-11-17

申请号：US17322294

申请日：2021-05-17

Applicant: Qualcomm Incorporated

Inventor： Hong-Ming Lee ,  Darryl Sheldon Jessie

IPC: H04B1/04 ,  H04B1/16 ,  H04B1/10 ,  H01Q23/00

Abstract: An apparatus is disclosed for implementing an antenna tuner. In an example aspect, the apparatus includes a substrate, an antenna disposed on or in the substrate, a radio-frequency integrated circuit disposed on the substrate, and an antenna tuner. The radio-frequency integrated circuit includes an amplification circuit. The antenna tuner is coupled between the antenna and the amplification circuit. The antenna tuner includes an inductive component disposed on or in the substrate and a capacitive component implemented within the radio-frequency integrated circuit.

公开(公告)号：US11804865B2

公开(公告)日：2023-10-31

申请号：US17322294

申请日：2021-05-17

Applicant: Qualcomm Incorporated

Inventor： Hong-Ming Lee ,  Darryl Sheldon Jessie

IPC: H04B1/04 ,  H04B1/16 ,  H01Q23/00 ,  H04B1/10

CPC classification number: H04B1/0458 ,  H01Q23/00 ,  H04B1/1036 ,  H04B1/1607 ,  H04B2001/0408

Abstract: An apparatus is disclosed for implementing an antenna tuner. In an example aspect, the apparatus includes a substrate, an antenna disposed on or in the substrate, a radio-frequency integrated circuit disposed on the substrate, and an antenna tuner. The radio-frequency integrated circuit includes an amplification circuit. The antenna tuner is coupled between the antenna and the amplification circuit. The antenna tuner includes an inductive component disposed on or in the substrate and a capacitive component implemented within the radio-frequency integrated circuit.