Invention Grant
- Patent Title: Configuration of artificial intelligence (AI) modules and compression ratios for user-equipment (UE) feedback
-
Application No.: US17116901Application Date: 2020-12-09
-
Publication No.: US11595847B2Publication Date: 2023-02-28
- Inventor: Hamed Pezeshki , Tao Luo , Sony Akkarakaran , Mahmoud Taherzadeh Boroujeni , Taesang Yoo , Arumugam Chendamarai Kannan , Jingchao Bao
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson + Sheridan, L.L.P.
- Main IPC: H04W28/06
- IPC: H04W28/06 ; G06N20/00 ; H04B7/0456 ; H04B7/06 ; H04W24/10 ; H04W72/04 ; H04W76/27 ; H04W80/02 ; G06N3/04 ; G06N3/08

Abstract:
Certain aspects of the present disclosure provide techniques for feedback compression. Certain aspects provide a method for wireless communication by a user-equipment (UE). The method generally includes receiving, from a base station, a configuration to be used for compressing one or more measurements corresponding to at least one reference signal using an artificial intelligence (AI) encoder; receiving the at least one reference signal; and transmitting a codeword to the base station, the codeword being associated with a compression of the one or more measurements in accordance with the configuration.
Public/Granted literature
Information query