Invention Grant
- Patent Title: Using sacrificial solids in semiconductor processing
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Application No.: US17186282Application Date: 2021-02-26
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Publication No.: US11600485B2Publication Date: 2023-03-07
- Inventor: Matthew S. Thorum , Gurtej S. Sandhu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/677 ; H01L21/311 ; H01L21/67
Abstract:
In an example, a method may include closing an opening in a structure with a sacrificial material at a first processing tool, moving the structure from the first processing tool to a second processing tool while the opening is closed, and removing the sacrificial material at the second processing tool. The structure may be used in semiconductor devices, such as memory devices.
Public/Granted literature
- US20210183643A1 USING SACRIFICIAL SOLIDS IN SEMICONDUCTOR PROCESSING Public/Granted day:2021-06-17
Information query
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