Invention Grant
- Patent Title: Memory devices and methods of forming memory devices
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Application No.: US16744223Application Date: 2020-01-16
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Publication No.: US11600664B2Publication Date: 2023-03-07
- Inventor: Lanxiang Wang , Shyue Seng Tan , Eng Huat Toh , Benfu Lin
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Viering Jentschura & Partner MBB
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A memory device may be provided, including a substrate; one or more bottom electrodes arranged over the substrate; one or more switching layers arranged over the one or more bottom electrodes; and a plurality of top electrodes arranged over the one or more switching layers. Each of the one or more bottom electrodes may include at least one corner tip facing the switching layer, and an angle of each of the at least one corner tip may be less than ninety degrees.
Public/Granted literature
- US20210225936A1 MEMORY DEVICES AND METHODS OF FORMING MEMORY DEVICES Public/Granted day:2021-07-22
Information query
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