- 专利标题： Solder preform with internal flux core including thermochromic indicator
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申请号： US16862299申请日： 2020-04-29
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公开(公告)号： US11602808B2公开(公告)日： 2023-03-14
- 发明人: Craig K. Merritt , Anthony D. Lanza, Jr. , James B. Hevel
- 申请人： INDIUM CORPORATION
- 申请人地址： US NY Utica
- 专利权人： INDIUM CORPORATION
- 当前专利权人： INDIUM CORPORATION
- 当前专利权人地址： US NY Utica
- 代理机构： Sheppard, Mullin, Richter & Hampton LLP
- 主分类号： B23K35/02
- IPC分类号： B23K35/02 ; B23K35/22 ; B23K35/26 ; B23K101/32 ; B23K101/06
摘要：
Some implementations of the disclosure are directed to a solder preform, comprising: a solder alloy body, the solder alloy body comprising at least one opening; and a flux core embedded in the solder alloy body, the flux core comprising a thermochromic indicator, wherein during reflow soldering, the flux core comprising the thermochromic indicator is configured to flow out of the at least one opening of the solder alloy.
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