- Patent Title: Multilayer seed pattern inductor and manufacturing method thereof
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Application No.: US16803315Application Date: 2020-02-27
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Publication No.: US11605484B2Publication Date: 2023-03-14
- Inventor: Woon Chul Choi , Myung Jun Park , Hye Min Bang , Jun Ah , Myung Sam Kang , Jung Hyuk Jung
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2015-0065320 20150511
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F27/255 ; H01F41/04

Abstract:
A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |