公开(公告)号：US11605484B2

公开(公告)日：2023-03-14

申请号：US16803315

申请日：2020-02-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Woon Chul Choi ,  Myung Jun Park ,  Hye Min Bang ,  Jun Ah ,  Myung Sam Kang ,  Jung Hyuk Jung

IPC: H01F17/00 ,  H01F27/255 ,  H01F41/04

Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.

公开(公告)号：US10319515B2

公开(公告)日：2019-06-11

申请号：US15047214

申请日：2016-02-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung hyuk Jung ,  Woon Chul Choi ,  Jun Ah ,  Myung Jun Park ,  Hye Min Bang

IPC: H01F27/29 ,  H01F17/00 ,  H01F41/04 ,  H01F17/04

Abstract: A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.

公开(公告)号：US20160307693A1

公开(公告)日：2016-10-20

申请号：US15001001

申请日：2016-01-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tai Yon Cho ,  Doo Young Kim ,  Sang Ho Shin ,  Jun Ah ,  Woo Kyung Sung

IPC: H01F27/29 ,  H01F41/04 ,  H01F41/02 ,  H01F27/28

CPC classification number: H01F17/04 ,  H01F27/2828 ,  H01F27/292 ,  H01F2017/048

Abstract: An electronic component includes a coil including lead terminals plated with a metal; a body part filling a space around the coil; and external electrodes connected to the lead terminals of the coil. At least portions of the lead terminals of the coil are exposed externally of the body part.

Abstract translation: 电子部件包括：线圈，其包括镀有金属的引线端子; 身体部分填充线圈周围的空间; 以及连接到线圈的引线端子的外部电极。 线圈的引线端子的至少一部分暴露在主体部分的外部。