Invention Grant
- Patent Title: Semiconductor device including insulating layers and method of manufacturing the same
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Application No.: US16353750Application Date: 2019-03-14
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Publication No.: US11605714B2Publication Date: 2023-03-14
- Inventor: Dong Kak Lee , Min Woo Kim , Bong Hyun Kim , Hee Young Park , Seo Jin Ahn , Won Yong Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2018-0106106 20180905
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/10 ; H01L21/762 ; H01L27/108

Abstract:
A semiconductor device includes a trench defining an active region in a substrate, a first insulating layer on a bottom surface and side surfaces of the active region inside the trench, a shielding layer on a surface of the first insulating layer, the shielding layer including a plurality of spaced apart particles, a second insulating layer on the shielding layer and having first charge trapped therein, the plurality of spaced apart particles being configured to concentrate second charge having an opposite polarity to the charge trapped in the second insulating layer, and a gap-fill insulating layer on the second insulating layer in the trench.
Public/Granted literature
- US20200075730A1 SEMICONDUCTOR DEVICE INCLUDING INSULATING LAYERS AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2020-03-05
Information query
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