发明授权
- 专利标题: Semiconductor device including insulating layers and method of manufacturing the same
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申请号: US16353750申请日: 2019-03-14
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公开(公告)号: US11605714B2公开(公告)日: 2023-03-14
- 发明人: Dong Kak Lee , Min Woo Kim , Bong Hyun Kim , Hee Young Park , Seo Jin Ahn , Won Yong Lee
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Myers Bigel, P.A.
- 优先权: KR10-2018-0106106 20180905
- 主分类号: H01L29/40
- IPC分类号: H01L29/40 ; H01L29/10 ; H01L21/762 ; H01L27/108
摘要:
A semiconductor device includes a trench defining an active region in a substrate, a first insulating layer on a bottom surface and side surfaces of the active region inside the trench, a shielding layer on a surface of the first insulating layer, the shielding layer including a plurality of spaced apart particles, a second insulating layer on the shielding layer and having first charge trapped therein, the plurality of spaced apart particles being configured to concentrate second charge having an opposite polarity to the charge trapped in the second insulating layer, and a gap-fill insulating layer on the second insulating layer in the trench.
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